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Darryl Girbach

Darryl Girbach

Saline, MI, USA

Software Engineer

DevOps / Release Manager at Sema

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    Background

    University of Michigan Electrical Engineering and Computer Science degree. Experience in all roles with software development: Java programming, QA, BA, DevOps, Team Manager.


    Job experience

    • February 2019 - June 2019
      DevOps / Release Manager
      Sema
      Baltimore, MD, USA

      Automated software build, test, deployment on AWS with Jenkins and a GitHub repository.

    • January 2018 - August 2018
      Product Designer & Technical Business Analyst
      Ford
      Allen Park, MI, USA

      My primary responsibility was to understand their business needs and OTA (Over-The-Air) web application delivery process and design the user interface to support new functionality. I also managed the agile SCRUM process with the developers using CA Rally.

    • July 2013 - November 2017
      Software Developer & DevOps
      Federal-Mogul Motorparts
      Southfield, MI, USA

      Wrote Java code for their online auto-parts ordering system. Then when much of their DevOps support team was out-sourced to India, I managed LDAP, SiteMinder, resolved user issues and advised functional improvements to the parts ordering online application.

    • March 2012 - June 2013
      Software Engineer
      Campfire Interactive
      Ann Arbor, MI, USA

      identify solutions and implement them to advance Campfires web application for forecasting automotive future business.

    • October 2003 - February 2012
      Software Engineer
      HealthMedia / Johnson & Johnson
      Ann Arbor, MI, USA

      At HealthMedia my role changed several times from Java developer to managing and growing the software development team (4 to 15 developers), to starting an O&M team to resolve bugs and customer issues for 15+ HealthMedia web applications

    • January 1990 - September 2002
      Senior CAD Software Engineer
      Intel
      Chandler, AZ, USA

      Automated the CAD process and tools to reduce the time needed to create the package interconnect between the Semi-conductor chip and the system motherboard. I observed mechanical and electrical CAD development, proposed and implemented automation solutions to manage workflow and reduce cost and throughput time.


    Education

    • University of Michigan, Ann Arbor
      BSE - Electrical Engineering and Computer Science
      1984 - 1989
      Focused studies in software development and digital electronics.